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Home Page - Technical Article - Application of Madoka Automatic gel Time Tester in Epoxy Plastic Sealants for Wafer Level Chip Packaging (WLCSP)
Wafer Level Chip Scale Packaging (WLCSP) is currently a very important technology in advanced semiconductor packaging. Due to the lack of traditional lead frames and plastic packaging materials, it meets the demand for lightweight and miniaturized consumer electronics products such as smartphones and smartwatches. Abandoning traditional metal leads, it is directly connected to the circuit board through tiny solder balls on the surface of the chip. The transmission path greatly reduces resistance and inductance, resulting in better high-frequency signal transmission performance and lower power consumption.
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